Detecting presence, protrusion, and tilting of wafers in FOUP

Detection of wafer presence, protrusion, and tilt inside the FOUP is performed using two BGS‑HDL sensors. Because the BGS‑HDL has two control outputs, wafer presence can be detected with Output 1, and protrusion can be detected with Output 2. Wafer tilt can be determined from the ON/OFF timing of Output 1 of the left and right sensors.

• High-accuracy Laser Sensors

  BGS-HL/BGS-HDL Series

  High resolution BGS laser sensor