Chip mounting positioning in high-temperature environment

  • Chip mounting positioning in high-temperature environment

Before placing a chip on to a lead frame, positioning is performed with a camera and coaxial lighting. Since heating is performed from below for adhesion, the rise in ambient temperature causes the lighting brightness to fluctuate, leading to variations in positioning accuracy. With sensing coaxial lighting, not only can the lighting temperature be monitored from the OPPD-30E controller but a feedback function adjusts the brightness so that it remains constant even as the temperature increases. This minimizes the variations in inspection accuracy.

Products Used

  • Sensing Coaxial Lighting

    OPX Series

    Surface light source with a narrow directivity angle

    OPX Series
  • LED Lighting Controller with Ethernet Connectivity

    OPPD-30 Series

    Easy Ethernet connectivity

    OPPD-30 Series

Application Examples for Electronic Components

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