The CD2H series displacement sensor can be used to measure the sag of a robot arm.
The CD2H can perform measurement at long ranges of up to 1,200 mm with high accuracy.
This series is also compatible with IO-Link, so it can be used to easily obtain more accurate measured values.

The CD2H series laser displacement sensor can be used to measure the thickness of surface-polished fine ceramic plates.
The thickness is measured in five locations simultaneously, at the four corners and the center of the ceramic plate. Using the 30 mm short range type for the four corners and the 130 mm middle range type for the center allows for the thickness to be measured in five locations at the same time.
With the highest repeatability of 0.25 µm in its class, the CD2H ensures highly accurate measurement. This series is also compatible with IO-Link, so measured values can be immediately logged using dedicated free software.

The CDX series of laser displacement sensors measure deflection of dicing saws.
With a spot size of ø30 μm, the CDX-30A can be used for measurement of both the side of the blade and the narrow end surface.
This allows for high-accuracy measurement for not only width but also height.

CD33-L30 laser displacement sensors can be used to measure the orientation of a wafer on a robot arm.
Because they are specular reflection type sensors, CD33-L30 sensors enable accurate orientation measurement even with specular objects like wafers.
In addition, using the UQ1-02 as a controller allows the sensors to be easily connected to Mitsubishi Electric MELSEC-Q series modules. Moreover, using the dedicated UQ1 Navigator setup software makes it possible for anyone to easily set up calculation settings when using multiple sensors.

Measurement of warpage of the semiconductor frame in the vacuum chamber by CD5-W500. Measurement range of CD5-W500 is 500+/-200mm so it can measure warpage from long distance, outside of the chamber through the view port. By utilizing control unit UQ1-01, connection to Mitsubishi MELSEC-Q series will be very easy and calculation using multiple sensor heads can be set in short time.

Measurement of thickness of semiconductor wafer by laser displacement sensor CD5-L25.
By utilizing control unit UQ1-01, the sensor can be connected to Mitsubishi MELSEC-Q series without CD5 amplifier. It doesn't need ladder programs so the installation will be completed in short time.

Measurement of deviation of the wafer position through the view port to confirm if the wafer is sitting on the robot arm correctly or not.
Also, by measuring position of robot arm, you can check if the robot arm is at the correct position or not.

CD5 can measure the size of silicon ingot stably by its "Tri-CORE" function even if the reflection is not stable.

Warpage of the tray in heat chamber can be measured by CD33-250 through view port in repeat accuracy of 75μm up to 400mm distance maximum.

Detecting deviation of PWB by laser displacement sensor CD33.
Utilizing its C-MOS image sensor, sub-pixel processing and automatic sensitivity adjusting function, it can detect PWB position stably even if the color varies.

At the ink jet coating process, CD5-30 can measure the thickness of the coating applied on the glass substrate.
CD5-30's repeat accuracy is 0.2μm which can be utilized for measurement of liquid crystal orientation membrane and also for solar cell industry.

By measuring height of silicon substrate by laser displacement sensor CD5, controls depth of annealing.
Specular type CD5-L25 can measure distance with 0.02μm repeat accuracy so it can measure the thickness of annealing accurately and control it.

Laser displacement sensor CD33-L30 measures distance to FPD glass surface for controlling focus of the microscope of the repair system.
Cost efficient CD33 series can be used for this kind of high accuracy FPD repair system.