The DR-Q series can be used to detect misalignment of transparent glass substrates.
Since the light axis of both the receiver and emitter are a coaxial structure, high-accuracy positioning is possible.

The presence, protrusion, and tilting of wafers can be detected with two BGS-HDL series sensors.
Since the BGS-HDL series has two control outputs, the presence of wafers can be detected using output 1 and protrusion using output 2.　The tilting of wafers can be detected based on the ON/OFF timing of output 1 from sensors on the left and right.

The BGS-HDL series enables detection of silicon wafer misalignment on a wafer stage.
Misaligned wafers can be up to 5 mm higher than normal, while the BGS-HDL05T is capable of detecting height differences of 0.08 mm, ensuring high-accuracy performance.

Long range laser BGS sensor TOF-L can detect existence of the wafer on the robot hand.
It can detect the wafer even the wafer position is high or low in 0 to 4.5 meter range.

BGS-HL25t2 can detect very thin object like wafer frame because of its small spot size, φ1mm at 250mm distance from the sensor.

BGS-HL has automatic electric shutter function which adjusts sensitivity depends on reflection at the surface of the object that can be utilized for detection of shiny wafer.

By teaching at the notch, the sensor detects only the notch on the wafer and will never get influence from background because it is limited reflective type.

Set teaching without work piece using thru-beam side-view type Fiber cable.
Narrow beam of light (approximately 3 degrees angle) minimize stray reflections.

Coaxial reflective type with small spot size approximately φ2mm (at distance: 2m) makes it possible to detect transparent glass.
It can adjust sensitivity at optimum value with transparent teaching setting of amplifier D2SA.

Because of small spot size, φ2mm at 2meter distance, enables stable counting wafers without worrying about stray reflections.

Accurate detection is possible as no dead zone in sensing area.

Beam array type NF-DZ01 can detect lead frame. Its beam lighting can detect without any influences of holes on it.

NF-TH06 is set its light axis at 45 degrees angle.
Installation in small space is available as the sleeve length of receiver and emitter is different.

Chemical resistant fiber cable NF-TY02 is coated with fluorine resin.
It can detect wafers in corrosive environment.

Limited reflection type fiber cable NF-DC38 can detect FOUP even if the FOUP is transparent.

Narrow view type NF-TG02 has aperture angle of 2°.
It accurately detects a wafer without stray reflection.

Wafer mapping with limited reflection type NF-DC03. Minimum detectable thickness of the wafer is 0.5mm.

Array type is applied to optical system of NF-DF07 for liquid surface detection.
Stable liquid surface detection is available without getting influences from air bubbles and water drops.

Thru-beam type laser sensor ZT-L3000 can detect carrier trays in chamber through small window. Its small spot size realizes accurate positioning.

Fiber sensor amplifier D3IF and NF-TW01 can detect overlapping silicon wafers.
Wavelength of the light is 1.45μm which goes through silicon wafer and amount of the light changes depends on thickness of the silicon wafer.

Fiber sensor D3IF and specific thru-beam type fiber cable NF-TW01 can detect overlapping films.
As infrared LED applied to D3IF is a wavelength of 1.45μm, stable detection is available.

High speed digital fiber sensor amplifier D4RF can be utilized to detect speed of turn table by counting rotation of the turn table for coating stage of solar-cell.
Response time of D4RF is 16micro sec. which is enough speed to detect rotation of the turn table.