Photoelectric Sensors
Paper Position on Cutting Machine
- Positioning Automotive Components
- Detecting Presence, Protrusion, and Tilting of Wafers in FOUP
- Paper Position on Cutting Machine
- Alignment of glass substrate
- Detecting edge of wafer frame
- Detect glass wafer notch
- Wafer mapping (1)
- Wafer mapping (2)
Positioning Automotive Components
The BGS-HDL series is used for positioning during automotive component assembly.
Detecting holes at an angle is difficult with photoelectric sensors, but The BGS-HDL series allows for stable detection, even when mounting is only possible diagonally, by using "AUTO mode" to always detect with the optimal sampling period.
Model: High-resolution C-MOS Laser Sensor BGS-HDL Series
Detecting Presence, Protrusion, and Tilting of Wafers in FOUP
The presence, protrusion, and tilting of wafers can be detected with two BGS-HDL series sensors.
Since the BGS-HDL series has two control outputs, the presence of wafers can be detected using output 1 and protrusion using output 2. The tilting of wafers can be detected based on the ON/OFF timing of output 1 from sensors on the left and right.
Model: High-resolution C-MOS Laser Sensor BGS-HDL Series
Paper Position on Cutting Machine
The BGS-HDL05T is useful for detection of paper positioning on a cutting machine.
Detection is performed when a stack of paper hits against the stopper, then the cutter blade cuts the paper to the preset size.
The BGS-HDL05T’s ability to detect a gap of just 0.08 mm ensures high-accuracy detection even with paper thicknesses up to 0.25 mm.
In addition, stable detection is possible even for glossy paper against a shiny background such as metal.
Model: High-resolution C-MOS Laser Sensor BGS-HDL Series
Alignment of glass substrate
Limited reflection type (heat resistant up to 250℃) enables alignment of glass substrate.
As sensor window is dual structure, detection is not affected by leaning of substrate.
Model: Limited reflection type fiber cable NF-DH10
Detecting edge of wafer frame
BGS-HL25t2 can detect very thin object like wafer frame because of its small spot size, φ1mm at 250mm distance from the sensor.
Model: Accurate C-MOS laser sensor BGS-HL Series
Detect glass wafer notch
By teaching at the notch, the sensor detects only the notch on the wafer and will never get influence from background because it is limited reflective type.
Model: Fiber cable NF-DC38/DC39
Wafer mapping (1)
Narrow view type NF-TG02 has aperture angle of 2°.
It accurately detects a wafer without stray reflection.
Model: Narrow view type, wafers mapping fiber cable NF-TG02
Wafer mapping (2)
Wafer mapping with limited reflection type NF-DC03. Minimum detectable thickness of the wafer is 0.5mm.
Model: Limited reflective type fiber cable NF-DC03
Application examples
by industry
- Foods
- Beverage
- Chemical/Cosmetics
- Packaging
- Semicon
- FPD/PV
- Electric
- Electronics Components
- Automotive
- Machinery
- Rubber/Plastic
- Glass
- Printing
- Logistics
Application examples
by industry
- Detecting existence
- Counting/Detecting passing
- Alignment/Mapping/Positioning
- Detecting direction/sides
- Detecting height/level difference
- Detecting overlapping
- Detecting protruding
- Detecting meandering
- Detecting wrong objects
- Detecting black/glossy objects
- Detecting liquid
- Long range detection
- Pin-point detection
- Detecting transparent objects
- Environmental resistant
- Detecting color and mark
- Others