Photoelectric Sensors

Paper Position on Cutting Machine

Paper Position on Cutting Machine

Paper Position on Cutting Machine

The BGS-HDL05T is useful for detection of paper positioning on a cutting machine.
Detection is performed when a stack of paper hits against the stopper, then the cutter blade cuts the paper to the preset size.
The BGS-HDL05T’s ability to detect a gap of just 0.08 mm ensures high-accuracy detection even with paper thicknesses up to 0.25 mm.
In addition, stable detection is possible even for glossy paper against a shiny background such as metal.

Model: High-resolution C-MOS Laser Sensor  BGS-HDL series




Alignment of glass substrate

Alignment of glass substrate

Limited reflection type (heat resistant up to 250℃) enables alignment of glass substrate.
As sensor window is dual structure, detection is not affected by leaning of substrate.

Model: Limited reflection type fiber cable  NF-DH10




Detecting edge of wafer frame

Detecting edge of wafer frame

BGS-HL25t2 can detect very thin object like wafer frame because of its small spot size, φ1mm at 250mm distance from the sensor.

Model: Accurate C-MOS laser sensor  BGS-HL series




Detect glass wafer notch

Detect glass wafer notch

By teaching at the notch, the sensor detects only the notch on the wafer and will never get influence from background because it is limited reflective type.

Model: Fiber cable  NF-DC38/DC39




Wafer mapping (1)

Wafer mapping (1)

Narrow view type NF-TG02 has aperture angle of 2°.
It accurately detects a wafer without stray reflection.

Model: Narrow view type, wafers mapping fiber cable  NF-TG02




Wafer mapping (2)

Wafer mapping  (2)

Wafer mapping with limited reflection type NF-DC03. Minimum detectable thickness of the wafer is 0.5mm.

Model: Limited reflective type fiber cable  NF-DC03