The BGS-HDL series is used for positioning during automotive component assembly.
Detecting holes at an angle is difficult with photoelectric sensors, but The BGS-HDL series allows for stable detection, even when mounting is only possible diagonally, by using "AUTO mode" to always detect with the optimal sampling period.

The presence, protrusion, and tilting of wafers can be detected with two BGS-HDL series sensors.
Since the BGS-HDL series has two control outputs, the presence of wafers can be detected using output 1 and protrusion using output 2.　The tilting of wafers can be detected based on the ON/OFF timing of output 1 from sensors on the left and right.

The BGS-HDL05T is useful for detection of paper positioning on a cutting machine.
Detection is performed when a stack of paper hits against the stopper, then the cutter blade cuts the paper to the preset size.
The BGS-HDL05T’s ability to detect a gap of just 0.08 mm ensures high-accuracy detection even with paper thicknesses up to 0.25 mm.
In addition, stable detection is possible even for glossy paper against a shiny background such as metal.

Limited reflection type (heat resistant up to 250℃) enables alignment of glass substrate.
As sensor window is dual structure, detection is not affected by leaning of substrate.

BGS-HL25t2 can detect very thin object like wafer frame because of its small spot size, φ1mm at 250mm distance from the sensor.

By teaching at the notch, the sensor detects only the notch on the wafer and will never get influence from background because it is limited reflective type.

Narrow view type NF-TG02 has aperture angle of 2°.
It accurately detects a wafer without stray reflection.

Wafer mapping with limited reflection type NF-DC03. Minimum detectable thickness of the wafer is 0.5mm.